Snaptron’s metal dome arrays, called Peel-N-Place™ Arrays, are pre-loaded polyester dome carriers backed with pressure-sensitive adhesive. Metal dome arrays are essentially the tactile user interface on your product. Arrays come loaded with the domes of your choice, cut to size and shape you specify. So, whether your printed circuit board has one or a hundred metal domes, Snaptron’s Peel-N-Place™ arrays help reduce labor costs by easing the assembly process.